XANTAR® LDS
Diversification, styling, miniaturization and cost reduction are trends in portable electronics. LDS is becoming increasingly popular as the MID technology to enable an increased number of novel functions available inside appealing housings and covers, such as smart phones and notebooks. With LDS, tailored plastic materials are activated locally using a laser, and subsequently metalized exclusively in the activated areas, thus enabling a fast, highly flexible and 3D-design of for instance antennas in existing parts such as covers and frames.
The XANTAR LDS portfolio is ideally suited for integrated mobile phone antennas from antenna carriers to fully integrated antennas in the housing or frame. The application area has now been extended to antennas in laptops and notebooks.
Full Colour custom-made PC- and PC/ABS-based grades are available that enable selective electroless plating by means of laser direct structuring (LDS) to integrate electric circuits into moulded parts. For parts that require soldering, specially developed high-temperature
Reny® LDS grades are available.
Benefits of XANTAR
® LDS for laser direct structuring technology (based on joint development with
LPKF):
Optimized for LDS technology:
- Highest-impact material available for laser direct structuring
- Halogen free flame retardant
- Resolution (line/space) down to 100 microns
- Extremely well suited for antennas in mobile phones and notebooks
- Full colour availability for PC- and PC/ABS based LDS grades
High-performance/robustness:
- Dielectric constant of PC/ABS helps to assure high antenna performance
- Outstanding impact strength outperforms competitive PC-blends
Advantages of innovative LDS technology:
- Higher flexibility compared to other moulded interconnect device (MID) technologies, providing faster time-to-market
- Enables 3D shapes and electrical connections simultaneously
- Suitable for relatively small surface areas
- Only three process steps: moulding, laser processing, metallization
XANTAR® LDS GRADE LINE UP
Mitsubishi Engineering-Plastics, the global leader in high performance Laser Direct Structuring (LDS) materials, meets the rapidly-changing design and functional requirements of the portable electronics market with the first-time availability of full-color XANTAR
® LDS grades, including newly-introduced full-color high practical impact strength, and chlorine- and bromine-free innovations.
The enhancement of Mitsubishi Engineering-Plastics's highly-successful XANTAR
® PC and PC/ABS LDS portfolio to cover the complete color spectrum heralds a breakaway from the traditional blacks and grays of electronic parts. Combined with the range's versatility it creates virtually endless design opportunities for customers in the aesthetic- and function-driven application segments of mobile and smart phones, tablets, and ultra-thin notebooks.
| XANTAR® |
LDS 371# |
LDS 372# |
LDS 373# |
LDS 375# |
| See respective Product Data Sheets for more details |
| Polymer type: |
PC/ABS |
PC/ABS designed for mobile phone housing |
PC + elastomer |
PC |
| Target application: |
Mobile phone |
Mobile phone |
Notebook / Tablet/ Mobile phone |
Notebook / Tablet |
| Functional part: |
Internal carrier |
Cover / Housing |
Internal carrier / Painter Cover |
Cover / Housing |
| Specific property: |
High Izod impact |
High puncture impact |
High impact + flame retardant |
Good surface + high flame retardant |
